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Eximpedia analyzes Ding Sheng International Co Limited export and import records, including data from 0 buyers and 1 suppliers. We provide an intelligence report of Ding Sheng International Co Limited that covers trade statistics, shipment values, quantities, exporters & importers and trade destinations
Ding Sheng International Co Limited import markets
Explore the Ding Sheng International Co Limited import market with monthly import values, major importers, HS Codes, key ports, top suppliers, and competitors
HS CODE | USD VALUE | SHIPMENTS | % |
---|---|---|---|
38101000 | 4.64 | 285 | 85.59 |
PICKLING PREPARATIONS FOR METAL SURFACES; FLUXES AND OTHER AUXILIARY PREPARATIONS FOR SOLDERING, BRAZING OR WELDING; SOLDERING, BRAZING OR WELDING POWDERS AND PASTES CONSISTING OF METAL AND OTHER MATERIALS; PREPARATIONS OF A KIND USED AS CORES OR COATINGS | |||
38109000 | 1.02 | 41 | 12.31 |
PICKLING PREPARATIONS FOR METAL SURFACES; FLUXES AND OTHER AUXILIARY PREPARATIONS FOR SOLDERING, BRAZING OR WELDING; SOLDERING, BRAZING OR WELDING POWDERS AND PASTES CONSISTING OF METAL AND OTHER MATERIALS; PREPARATIONS OF A KIND USED AS CORES OR COATINGS | |||
80030010 | 0.11 | 1 | 0.30 |
TIN BARS, RODS, PROFILES AND WIRE | |||
71069200 | 0.01 | 5 | 1.50 |
SILVER (INCLUDING SILVER PLATED WITH GOLD OR PLATINUM), UNWROUGHT OR IN SEMI-MANUFACTURED FORMS, OR IN POWDER FORM | |||
80030090 | 0.00 | 1 | 0.30 |
TIN BARS, RODS, PROFILES AND WIRE |
COUNTRY | USD VALUE | SHIPMENTS | % |
---|---|---|---|
JAPAN | 4.56 | 296 | 88.89 |
CHINA | 1.22 | 37 | 11.11 |
PORT NAME | USD VALUE | SHIPMENTS | % |
---|---|---|---|
BAC GIANG | 3.01 | 169 | 50.75 |
BAC NINH | 2.62 | 158 | 47.45 |
HO CHI MINH CITY | 0.04 | 4 | 1.20 |
QUANG NINH | 0.11 | 2 | 0.60 |
COMPANY | USD VALUE | SHIPMENTS |
---|---|---|
LG ELECTRONICS VIETNAM HAI PHONG CO LIMITED | 10.45 | 535946 |
DIOPS VINA JOIN STOCK COMPANY | 11.19 | 1168 |
HANYANG DIGITECH VINA COMPANY LIMITED | 11.98 | 56981 |
ATECH JOINT STOCK COMPANY | 14.38 | 2028 |
PT INTAN PERTIWI INDUSTRIES | 19.08 | 233 |
COMPANY | USD VALUE | SHIPMENTS |
---|---|---|
LT MATERIALS CO LIMITED | 8.84 | 915 |
DING SHENG INTERNATIONAL CO LIMITED | 9.28 | 337 |
ALPHA ASSEMBLY SOLUTIONS | 11.75 | 2044 |
CONG TY TNHH SOLUM VINA | 14.41 | 8468 |
SUMITOMO CORPORATION GLOBAL METALS CO LIMITED | 17.10 | 9801 |
If you are looking to establish relationship with Ding Sheng International Co Limited Automation you can save time by getting access to the key decision makers and get a detailed report.
Discover the Ding Sheng International Co Limited with product description, import values, quantities, exporter name, country of origin and key destinations.
HSN Code | Product Description | Imports | Exporter | Origin | Destination | Qty. |
---|---|---|---|---|---|---|
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 SOLDER PASTE INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1% (7440-50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 86 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 SOLDER PASTE INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1% (7440-50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 114 | ||
38101000 | FUH026#&LEAD-FREE SOLDER,S01XBIG58-M500-4,TIN82-88%,COPPER0.1-1%,BISMUTH 1-2%,DENATURED ACID HYDROGENATION ROSIN3-5%,2-(2-HEXYLOXYETHOXY)ETHANOL3 -5%,DIMER ACID1-3%.,591.00068.005 | JAPAN | VIETNAM | 400 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 SOLDER PASTE INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1%(7440-50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 1055 | ||
38101000 | FY097#&LEAD-FREE SOLDER S01XBIG58-M500-4 SOLDER PASTE INCLUDES: 1.TIN 82-88% (7440-31-5), 2.COPPER 0.1-1% (7440-50-8), 3.BISMUTH 1-2% (7440-69-9),...),591.00068.005 | JAPAN | VIETNAM | 100 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500 INCLUDES: TIN 82-88% (7440-31-5), SILVER 2-3% (7440-22-4), COPPER 0.1-1% (7440-50-8), DENATURED ACID HYDROGENATION ROSIN 3-5%,...500G/1 BOTTLE)),591.00046.005 | JAPAN | VIETNAM | 150 | ||
38109000 | FUH276#&LEAD-FREE TIN PASTE, S3X58-M500TIN:82-88%;SILVER 2-3%; COPPER 0.1-1%;DENATURED ACID HYDROGENATION ROSIN 3-5%; 2-(2-HEXYLOXYETHOXY)ETHANOL 3-5%;...,5C0302100-633-G | JAPAN | VIETNAM | 215 | ||
38101000 | FY097#&LEAD-FREE SOLDER PASTE (S3X70-M500 SOLDER PASTE SOLDER PASTE INCLUDES: 1.TIN 82-88%(7440-31-5),2.SILVER 2-3%(7440-22-4),500G /VIAL) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS, 591.00054.005 | JAPAN | VIETNAM | 40 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1%(7440 -50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 376 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1%(7440 -50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 24 | ||
38101000 | SOLDERING PASTE S3X70-M500, 500G/BOTTLE (CONTENT: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | CHINA | VIETNAM | 235 | ||
38101000 | SOLDERING PASTE S3X58-M500L, 500G/BOTTLE (CONTENT: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | CHINA | VIETNAM | 280 | ||
38101000 | SOLDERING PASTE S3X58-M500, 500G/BOTTLE (CONTENT: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 30 | ||
38101000 | SOLDERING PASTE S01XBIG58-M500-4, 500G/BOTTLE (CONTENT: TIN 82-88%, BISMUTH 1-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 20 | ||
38101000 | SOLDERING PASTE S3X58-A340, 500G/BOTTLE (CONTENT: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 30 | ||
38101000 | SOLDERING PASTE TF-MP2, 100G/BOTTLE (TP: DENATURED ACID HYDROGENATION ROSIN, 2-(2-HEXYLOXYETHOXY) ETHANOL,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 1.6 | ||
38101000 | SOLDERING PASTE S3X58-M406, 500G/BOTTLE (CONTENT: TIN 82-88%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 770 | ||
38109000 | FUH276#&LEAD-FREE TIN CREAM,S01XBIG58-M500-4,TIN 82-88%,COPPER 0.1-1%,BISMUTH 1-2%,DENATURED ACID HYDROGENATION ROSIN 3-5%,2-(2-HEXYLOXYETHOXY) ETHANOL 3-5%,DIMER ACID 1-3%.,591.00068.005 | JAPAN | VIETNAM | 400 | ||
38101000 | SOLDERING PASTE S3X70-NT2, 100G/BOTTLE (TP: TIN 75-80%, SILVER 2-3%, COPPER 0.1-1%,...) USED TO CONNECT COMPONENTS TO ELECTRONIC CIRCUIT BOARDS. NEW 100% | JAPAN | VIETNAM | 4000 | ||
38101000 | FY097#&LEAD-FREE SOLDER (S3X58-M500C-5 SOLDER PASTE INCLUDES: TIN 82-88%(7440-31-5), SILVER 2-3%(7440-22-4), COPPER 0.1-1% (7440-50-8),..., 500G/ 1 BOTTLE),5C0302C00-633-G | JAPAN | VIETNAM | 300 |
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