WISOL CO LIMITED TRADE DATA ANALYSIS
Access comprehensive trade data for Wisol Co Limited with ease. Explore trade shipments, top suppliers & buyers, and values without the hassle.
Wisol Co Limited – Overview
Eximpedia analyzes Wisol Co Limited export and import records, including data from 1 buyers and 1 suppliers. We provide an intelligence report of Wisol Co Limited that covers trade statistics, shipment values, quantities, exporters & importers and trade destinations
Wisol Co Limited Buyers, Suppliers & Shipments
Wisol Co Limited import markets
Explore the Wisol Co Limited import market with monthly import values, major importers, HS Codes, key ports, top suppliers, and competitors
TOP IMPORT HS CODE
| HS CODE | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| 85429000 | 65.30 | 6715 | 81.99 |
| ELECTRONIC INTEGRATED CIRCUITS | |||
| 85423100 | 6.35 | 87 | 1.06 |
| ELECTRONIC INTEGRATED CIRCUITS | |||
| 85411000 | 1.22 | 21 | 0.26 |
| DIODES, TRANSISTORS AND SIMILAR SEMI-CONDUCTOR DEVICES; PHOTOSENSITIVE SEMI-CONDUCTOR DEVICES; INCLUDING PHOTO VOLTAIC CELLS, WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES (LE D); MOUNTED PIEZO- ELECTRIC CRYSTALS | |||
| 85423900 | 0.24 | 9 | 0.11 |
| ELECTRONIC INTEGRATED CIRCUITS | |||
| 85340090 | 0.17 | 197 | 2.41 |
TOP IMPORT COUNTRY
| COUNTRY | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| KOREA, REPUBLIC OF | 72.42 | 7662 | 93.55 |
| VIETNAM | 0.77 | 91 | 1.11 |
| MALAYSIA | 0.20 | 79 | 0.96 |
| JAPAN | 0.18 | 282 | 3.44 |
| CHINA | 0.05 | 60 | 0.73 |
TOP IMPORT PORTS
| PORT NAME | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| BAC NINH | 73.69 | 8190 | 100.00 |
TOP IMPORT COMPETITORS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| MCNEX VINA CO LIMITED | 146.61 | 60375 |
| PT LG INNOTEK INDONESIA | 156.19 | 11012 |
| PT PEGAUNIHAN TECHNOLOGY INDONESIA | 158.60 | 38221 |
| UMC ELECTRONICS VIETNAM LIMITED | 169.85 | 135614 |
| INTEL PRODUCTS VIETNAM CO LIMITED | 179.04 | 72444 |
TOP IMPORT SUPPLIERS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| AMOSENSE CO LIMITED | 95.30 | 7977 |
| WISOL CO LIMITED | 130.59 | 8190 |
| UMC ELECTRONICS HONG KONG LIMITED | 143.44 | 102229 |
| MCNEX CO LIMITED | 146.54 | 46945 |
| PEGATRON CORPORATION | 158.59 | 204115 |
If you are looking to establish relationship with Wisol Co Limited Automation you can save time by getting access to the key decision makers and get a detailed report.
Wisol Co Limited Import Shipments
Discover the Wisol Co Limited with product description, import values, quantities, exporter name, country of origin and key destinations.
| HSN Code | Product Description | Imports | Exporter | Origin | Destination | Qty. |
|---|---|---|---|---|---|---|
| 85429000 | SWG42AGA0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SWG42AGA0001, CSP PROCESS, 100% NEW |  |
|
KOREA, REPUBLIC OF | VIETNAM | 68390 |
| 85429000 | SRG00ASE0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER), SRG00ASE0H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 8103 |
| 85429000 | SH722DN30H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)), 200UM()10UM THICK; SH722DN30H01, WLP PROCESS, 100% NEW PRODUCT | |
|
KOREA, REPUBLIC OF | VIETNAM | 168696 |
| 85429000 | SDG93HG40001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SDG93HG40001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 665812 |
| 85429000 | SWG42CBB0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SWG42CBB0001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 572736 |
| 85429000 | SRG55ASE0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER), SRG55ASE0H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 13068 |
| 85429000 | SRG55ASE0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER), SRG55ASE0H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 191628 |
| 85429000 | SWG62DBB0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SWG62DBB0001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 118048 |
| 85429000 | SR942AX70H01#&SEMICONDUCTOR WAFER USED IN WAFER(FAB) SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY: SR942AX70H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 219774 |
| 85429000 | SX806AZYT001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SX806AZYT001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 276644 |
| 85429000 | SHG42AA00001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SHG42AA00001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 13686 |
| 85429000 | SDG35CGN0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SDG35CGN0001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 22332 |
| 85429000 | SDG93HGS0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SDG93HGS0001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 30792 |
| 85429000 | SXG35AGM0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SXG35AGM0001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 100472 |
| 85429000 | SRG53APR0H02#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)); THICKNESS 350UM()10UM; SRG53APR0H02, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 83414 |
| 85429000 | SRG00ASE0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER), SRG00ASE0H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 162477 |
| 85429000 | SH780CA40001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SH780CA40001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 77370 |
| 85429000 | SHG72BA40001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SHG72BA40001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 23704 |
| 85429000 | SWG42ASE0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER), SWG42ASE0H01, WLP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 180498 |
| 85429000 | SX806AZYT001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SX806AZYT001, CSP PROCESS, 100% NEW | |
|
KOREA, REPUBLIC OF | VIETNAM | 156364 |
Get Started with Eximpedia
Start 5 Days Free Trial
No Pay, No Delay - 5 days Your Way!
Book a Free Demo
Learn How our platform works in just 20 minutes!
Download Free Sample Report
Free Import-Export Sample data-One Click Away!
Wisol Co Limited export markets
Explore the VIETNAM export market with monthly export values, major importers, HS Codes, key ports, top suppliers, and competitors
TOP EXPORT HS CODE
| HS CODE | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| 85423900 | 11.60 | 535 | 9.89 |
| ELECTRONIC INTEGRATED CIRCUITS | |||
| 85429000 | 5.97 | 1996 | 36.88 |
| ELECTRONIC INTEGRATED CIRCUITS | |||
| 85416000 | 1.85 | 2611 | 48.24 |
| DIODES, TRANSISTORS AND SIMILAR SEMI-CONDUCTOR DEVICES; PHOTOSENSITIVE SEMI-CONDUCTOR DEVICES; INCLUDING PHOTO VOLTAIC CELLS, WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES (LE D); MOUNTED PIEZO- ELECTRIC CRYSTALS | |||
| 90309010 | 0.06 | 2 | 0.04 |
| OSCILLOSCOPES, SPECTRUM ANALYSERS AND OTHER INSTRUMENTS AND APPARATUS FOR MEASURING OR CHECKING ELECTRICAL QUANTITIES, EXCLUDING METERS OF HEADING 9028; INSTRUMENTS AND APPARATUS FOR MEASURING OR DETECTING ALPHA, BETA, GAMMA, X-RAY, COSMIC OR OTHER IONISI | |||
| 85340090 | 0.03 | 41 | 0.76 |
TOP EXPORT COUNTRY
| COUNTRY | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| KOREA, REPUBLIC OF | 19.03 | 5373 | 99.28 |
| HONG KONG | 0.50 | 29 | 0.54 |
| CHINA | 0.01 | 10 | 0.18 |
TOP EXPORT PORTS
| PORTS | USD VALUE | SHIPMENTS | % |
|---|---|---|---|
| BAC NINH | 18.38 | 5016 | 92.68 |
| Bắc Ninh | 1.17 | 396 | 7.32 |
TOP EXPORT COMPETITORS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| STMICROELECTRONICS INC | 658.59 | 9215 |
| DHL SUPPLY CHAIN MANAGEMENT PHILS I | 4276.62 | 35299 |
| DHL SUPPLY CHAIN MGMT PHILS INC O B | 14892.42 | 41741 |
TOP EXPORT BUYERS
| COMPANY | USD VALUE | SHIPMENTS |
|---|---|---|
| INFINEON TECHNOLOGIES ASIA PACIFIC PRIVATE LIMITED | 267.00 | 3110 |
| CONG TY TNHH JMT VN | 269.62 | 11778 |
| SHARP CORPORATION | 276.55 | 10667 |
| CLOUD NETWORK TECHNOLOGY SINGAPORE PRIVATE LIMITED | 399.78 | 149034 |
| ON SEMICONDUCTOR TRADING SARL | 593.75 | 19737 |
If you are looking to establish relationship with Wisol Co Limited Automation you can save time by getting access to the key decision makers and get a detailed report.
Wisol Co Limited Export Shipments
Discover the Wisol Co Limited with product description, import values, quantities, exporter name, country of origin and key destinations.
| HSN Code | Product Description | Imports | Exporter | Origin | Destination | Qty. |
|---|---|---|---|---|---|---|
| 85429000 | SX806BXV0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SX806BXV0H01, WLP PROCESS, 100% NEW TX 1 PART DH 1 TK 105639015310/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 38078 |
| 85429000 | SHG93AXQ0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SHG93AXQ0H01, WLP PROCESS, 100% NEW TX 1 PART DH 14 TK 105644568040/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 162304 |
| 85429000 | SR881ASC0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)), 1.2*0.76*2MM;SR881ASC0H01, WLP PROCESS, 100% NEW TX 1 PART DH 35 TK 105638969220/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 92848 |
| 85429000 | SWG42AXU0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SWG42AXU0H01, WLP PROCESS, 100% NEW TX 1 PART DH 35 TK 105629476260/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 340333 |
| 85429000 | SXG47RUBT001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SXG47RUBT001, CSP PROCESS, 100% NEW TX 1 PART DH 22 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 261981 |
| 85429000 | SR806DX20H02#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)); THICKNESS 350UM()10UM; (SR806DX20H02), WLP STAGE, 100% NEW TX 1 PART DH 27 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 6849 |
| 85429000 | SR806DL50H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)), 200UM()10UM THICK; SR806DL50H01, WLP STAGE, 100% NEW TX 1 PART DH 15 TK 105644568040/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 4354 |
| 85429000 | SHG89XA40001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SHG89XA40001, CSP PROCESS, 100% NEW TX 1 PART DH 12 TK 105659655030/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 1814 |
| 85429000 | SX806AXV0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SX806AXV0H01, WLP PROCESS, 100% NEW TX 1 PART DH 37 TK 105629476260/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 38004 |
| 85429000 | SRG55DSE0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SRG55DSE0H01, WLP PROCESS, 100% NEW TX 1 PART DH 31 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 8628 |
| 39231090 | #&SEMICONDUCTOR BOX FOR MANUFACTURING PLASTIC INTEGRATED CIRCUITS, SIZE 1,650MM X 1,500MM X 1,200MM (REVOLVING CASE) | |
|
VIETNAM | KOREA, REPUBLIC OF | 113 |
| 85429000 | SRG00AXU0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SRG00AXU0H01, WLP PROCESS, 100% NEW TX 1 PART DH 25 TK 105629476260/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 9320 |
| 85429000 | SRG00AXU0H01#&SEMICONDUCTOR WAFERS USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SRG00AXU0H01, WLP PROCESS, 100% NEW TX 1 PART DH 28 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 210600 |
| 85429000 | SDG45EA40001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SDG45EA40001, CSP PROCESS, 100% NEW TX 1 PART DH 2 TK 105629476260/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 1802 |
| 85429000 | SWG00DB00001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SWG00DB00001, CSP PROCESS, 100% NEW TX 1 PART DH 12 TK 105638969220/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 1157 |
| 85429000 | SW742BXK0H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SW742BXK0H01, WLP PROCESS, 100% NEW TX 1 PART DH 34 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 40555 |
| 85429000 | SR942AX70H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP PRODUCTION TECHNOLOGY WAFER(FAB): SR942AX70H01, WLP PROCESS, 100% NEW TX 1 PART DH 36 TK 105638969220/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 12192 |
| 85429000 | SHG60BA00003#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SHG60BA00003, CSP PROCESS, 100% NEW TX 1 PART DH 8 TK 105623481350/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 40995 |
| 85429000 | SW742AL60H01#&SEMICONDUCTOR WAFER USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (WAFER(FAB)), 200UM()10UM THICK; SW742AL60H01, WLP STAGE, 100% NEW TX 1 PART DH 22 TK 105644568040/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 5701 |
| 85429000 | SHG93AGK0001#&SEMICONDUCTOR WAFER ASSEMBLY USED IN SEMICONDUCTOR CHIP MANUFACTURING TECHNOLOGY (CHIP); THICKNESS 350UM()10UM, SHG93AGK0001, CSP PROCESS, 100% NEW TX 1 PART DH 14 TK 105659655030/E11#&KR | |
|
VIETNAM | KOREA, REPUBLIC OF | 32628 |
Why should you choose Eximpedia?
Broad Range of Country Datasets
Our dedicated team of experts delivers current and flexible data from key global locations, enabling you to make essential decisions with vital information and insights.
Easy to understand deep analysis
We use bespoke layered visualizations for diving deep into our country and logistics data to provide your team with graphical assistance and essential data analysis and reporting.
Most Accurate Information
All of our datasets are quality-controlled by layers of inspection before it ever reach your platform. This helps us maintain the high reliability our clients have come to trust.
Competitive Supplier Engagement Watch
Keep an eye out for any collaboration between your suppliers and your rivals, as this may impact their ability to satisfy your requirements.
Right away on-screen support
With instant remote on-screen assistance, chat support, and user training, our customer success team is available to you around the clock.
Access Database Across 130+ Countries
Explore competitors' shipment histories, statistical and analytical reports, and country-specific information from more than 130 nations.